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Next Generation Non-Volatile Memory Market Size, Share & Trends Analysis Report By Type (High-bandwidth Memory (HBM) and Hybrid Memory Cube (HMC)), By Wafer Size (300 mm and 200 mm), By Application, By Regional Outlook and Forecast, 2024 - 2031

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    Report

  • 253 Pages
  • August 2024
  • Region: Global
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6004128
The Global Next Generation Non-Volatile Memory Market size is expected to reach $18.6 billion by 2031, rising at a market growth of 17.3% CAGR during the forecast period.

Premium consumer electronics, such as high-definition cameras and advanced gaming consoles, require memory that supports high data throughput and rapid access. As consumer electronics become more compact and lightweight, there is a need for memory solutions that fit within smaller device designs. Therefore, in 2023, the Consumer Electronics segment held 1/5th revenue share in the market. Next generation NVM technologies can provide high-density storage in compact form factors, enabling slimmer and more portable devices without sacrificing performance. Next generation NVM offers the performance needed to handle these high-end features effectively.



The amount of data generated globally is increasing at an unprecedented rate due to the proliferation of digital devices, IoT sensors, and data-driven applications. This surge in data creates a need for more efficient and larger storage solutions. There is a growing shift towards data-centric computing architectures, where storage and memory are optimized to handle massive data loads efficiently. With the increasing importance of data security and durability, next generation NVMs offer enhanced data protection features. Therefore, increasing data storage requirements is driving the growth of the market.

Moreover, as data processing needs evolve, the complexity of data tasks grows. High-speed data processing requires memory solutions that can handle complex data operations efficiently. Next generation NVMs are integral to these architectures, offering enhanced performance that aligns with the evolving demands of computing technologies. In conclusion, the rising demand for high-speed data processing propels the market's growth.

However, Existing systems and infrastructure may be built around older memory technologies with different interfaces and protocols. Integrating new NVM technologies often requires modifications or updates to existing systems to ensure compatibility, which can be complex and costly. Next generation NVM technologies may use new or proprietary interfaces that are not standardized across the industry. Ensuring these new interfaces work seamlessly with existing hardware and software systems can be challenging and may require additional development or adaptation. Hence, integration with existing systems is impeding the growth of the market.



The leading players in the market are competing with diverse innovative offerings to remain competitive in the market. The above illustration shows the percentage of revenue shared by some of the leading companies in the market. The leading players of the market are adopting various strategies in order to cater demand coming from the different industries. The key developmental strategies in the market are Acquisitions, and Partnerships & Collaborations.

Driving and Restraining Factors

Drivers

  • Increasing Data Storage Requirements
  • Rising Demand for High-Speed Data Processing
  • Expansion Of Consumer Electronics and Semiconductor Industry Worldwide

Restraints

  • High Development Costs of Next Generation NVM
  • Thermal Management Issues in Next Generation NVM

Opportunities

  • Rise of Quantum Computing
  • Increased Focus on Low-Power Devices

Challenges

  • Integration With Existing Systems
  • Complexity in Error Correction and Data Integrity

Type Outlook

Wafer Size Outlook

On the basis of wafer size, the market is segmented into 300 mm and 200 mm. In 2023, the 200 mm segment attained 40% revenue share in the market. 200 mm wafer fabs are often more affordable to set up and operate. This lower capital expenditure makes it easier for these companies to enter the market and contribute to the supply of next generation NVM technologies. 200 mm wafer fabs can be more adaptable to changes in technology and production needs.



Application Outlook

By application, the market is divided into BFSI, information technology, consumer electronics, telecommunications, government, and others. In 2023, the BFSI segment registered 22% revenue share in the market. Security is a top priority in the BFSI sector due to the sensitive nature of financial data. Next generation NVM offers advanced encryption and data protection features that help safeguard against unauthorized access and data breaches, ensuring compliance with stringent regulatory requirements.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. The Asia Pacific region witnessed 39% revenue share in the market in 2023. Asia-Pacific is home to leading technology and electronics manufacturers at the forefront of adopting and developing next generation technologies. Countries like China, South Korea, and Japan are major hubs for innovation in consumer electronics, computing, and telecommunications, driving the demand for advanced NVM solutions.

List of Key Companies Profiled

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Market Report Segmentation

By Type

  • High-bandwidth Memory (HBM)
  • Hybrid Memory Cube (HMC)

By Wafer Size

  • 300 mm
  • 200 mm

By Application

  • BFSI
  • Information Technology
  • Consumer Electronics
  • Telecommunications
  • Government
  • Others

By Geography

  • North America
  • US
  • Canada
  • Mexico
  • Rest of North America
  • Europe
  • Germany
  • UK
  • France
  • Russia
  • Spain
  • Italy
  • Rest of Europe
  • Asia Pacific
  • China
  • Japan
  • India
  • South Korea
  • Singapore
  • Taiwan
  • Rest of Asia Pacific
  • LAMEA
  • Brazil
  • Argentina
  • UAE
  • Saudi Arabia
  • South Africa
  • Nigeria
  • Rest of LAMEA

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 Global Next Generation Non-Volatile Memory Market, by Type
1.4.2 Global Next Generation Non-Volatile Memory Market, by Wafer Size
1.4.3 Global Next Generation Non-Volatile Memory Market, by Application
1.4.4 Global Next Generation Non-Volatile Memory Market, by Geography
1.5 Methodology for the research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2023
4.2 Porter Five Forces Analysis
Chapter 5. Global Next Generation Non-Volatile Memory Market by Type
5.1 Global High-bandwidth Memory (HBM) Market by Region
5.2 Global Hybrid Memory Cube (HMC) Market by Region
Chapter 6. Global Next Generation Non-Volatile Memory Market by Wafer Size
6.1 Global 300 mm Market by Region
6.2 Global 200 mm Market by Region
Chapter 7. Global Next Generation Non-Volatile Memory Market by Application
7.1 Global BFSI Market by Region
7.2 Global Information Technology Market by Region
7.3 Global Consumer Electronics Market by Region
7.4 Global Telecommunications Market by Region
7.5 Global Government Market by Region
7.6 Global Others Market by Region
Chapter 8. Global Next Generation Non-Volatile Memory Market by Region
8.1 North America Next Generation Non-Volatile Memory Market
8.1.1 North America Next Generation Non-Volatile Memory Market by Type
8.1.1.1 North America High-bandwidth Memory (HBM) Market by Country
8.1.1.2 North America Hybrid Memory Cube (HMC) Market by Country
8.1.2 North America Next Generation Non-Volatile Memory Market by Wafer Size
8.1.2.1 North America 300 mm Market by Country
8.1.2.2 North America 200 mm Market by Country
8.1.3 North America Next Generation Non-Volatile Memory Market by Application
8.1.3.1 North America BFSI Market by Country
8.1.3.2 North America Information Technology Market by Country
8.1.3.3 North America Consumer Electronics Market by Country
8.1.3.4 North America Telecommunications Market by Country
8.1.3.5 North America Government Market by Country
8.1.3.6 North America Others Market by Country
8.1.4 North America Next Generation Non-Volatile Memory Market by Country
8.1.4.1 US Next Generation Non-Volatile Memory Market
8.1.4.1.1 US Next Generation Non-Volatile Memory Market by Type
8.1.4.1.2 US Next Generation Non-Volatile Memory Market by Wafer Size
8.1.4.1.3 US Next Generation Non-Volatile Memory Market by Application
8.1.4.2 Canada Next Generation Non-Volatile Memory Market
8.1.4.2.1 Canada Next Generation Non-Volatile Memory Market by Type
8.1.4.2.2 Canada Next Generation Non-Volatile Memory Market by Wafer Size
8.1.4.2.3 Canada Next Generation Non-Volatile Memory Market by Application
8.1.4.3 Mexico Next Generation Non-Volatile Memory Market
8.1.4.3.1 Mexico Next Generation Non-Volatile Memory Market by Type
8.1.4.3.2 Mexico Next Generation Non-Volatile Memory Market by Wafer Size
8.1.4.3.3 Mexico Next Generation Non-Volatile Memory Market by Application
8.1.4.4 Rest of North America Next Generation Non-Volatile Memory Market
8.1.4.4.1 Rest of North America Next Generation Non-Volatile Memory Market by Type
8.1.4.4.2 Rest of North America Next Generation Non-Volatile Memory Market by Wafer Size
8.1.4.4.3 Rest of North America Next Generation Non-Volatile Memory Market by Application
8.2 Europe Next Generation Non-Volatile Memory Market
8.2.1 Europe Next Generation Non-Volatile Memory Market by Type
8.2.1.1 Europe High-bandwidth Memory (HBM) Market by Country
8.2.1.2 Europe Hybrid Memory Cube (HMC) Market by Country
8.2.2 Europe Next Generation Non-Volatile Memory Market by Wafer Size
8.2.2.1 Europe 300 mm Market by Country
8.2.2.2 Europe 200 mm Market by Country
8.2.3 Europe Next Generation Non-Volatile Memory Market by Application
8.2.3.1 Europe BFSI Market by Country
8.2.3.2 Europe Information Technology Market by Country
8.2.3.3 Europe Consumer Electronics Market by Country
8.2.3.4 Europe Telecommunications Market by Country
8.2.3.5 Europe Government Market by Country
8.2.3.6 Europe Others Market by Country
8.2.4 Europe Next Generation Non-Volatile Memory Market by Country
8.2.4.1 Germany Next Generation Non-Volatile Memory Market
8.2.4.1.1 Germany Next Generation Non-Volatile Memory Market by Type
8.2.4.1.2 Germany Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.1.3 Germany Next Generation Non-Volatile Memory Market by Application
8.2.4.2 UK Next Generation Non-Volatile Memory Market
8.2.4.2.1 UK Next Generation Non-Volatile Memory Market by Type
8.2.4.2.2 UK Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.2.3 UK Next Generation Non-Volatile Memory Market by Application
8.2.4.3 France Next Generation Non-Volatile Memory Market
8.2.4.3.1 France Next Generation Non-Volatile Memory Market by Type
8.2.4.3.2 France Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.3.3 France Next Generation Non-Volatile Memory Market by Application
8.2.4.4 Russia Next Generation Non-Volatile Memory Market
8.2.4.4.1 Russia Next Generation Non-Volatile Memory Market by Type
8.2.4.4.2 Russia Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.4.3 Russia Next Generation Non-Volatile Memory Market by Application
8.2.4.5 Spain Next Generation Non-Volatile Memory Market
8.2.4.5.1 Spain Next Generation Non-Volatile Memory Market by Type
8.2.4.5.2 Spain Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.5.3 Spain Next Generation Non-Volatile Memory Market by Application
8.2.4.6 Italy Next Generation Non-Volatile Memory Market
8.2.4.6.1 Italy Next Generation Non-Volatile Memory Market by Type
8.2.4.6.2 Italy Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.6.3 Italy Next Generation Non-Volatile Memory Market by Application
8.2.4.7 Rest of Europe Next Generation Non-Volatile Memory Market
8.2.4.7.1 Rest of Europe Next Generation Non-Volatile Memory Market by Type
8.2.4.7.2 Rest of Europe Next Generation Non-Volatile Memory Market by Wafer Size
8.2.4.7.3 Rest of Europe Next Generation Non-Volatile Memory Market by Application
8.3 Asia Pacific Next Generation Non-Volatile Memory Market
8.3.1 Asia Pacific Next Generation Non-Volatile Memory Market by Type
8.3.1.1 Asia Pacific High-bandwidth Memory (HBM) Market by Country
8.3.1.2 Asia Pacific Hybrid Memory Cube (HMC) Market by Country
8.3.2 Asia Pacific Next Generation Non-Volatile Memory Market by Wafer Size
8.3.2.1 Asia Pacific 300 mm Market by Country
8.3.2.2 Asia Pacific 200 mm Market by Country
8.3.3 Asia Pacific Next Generation Non-Volatile Memory Market by Application
8.3.3.1 Asia Pacific BFSI Market by Country
8.3.3.2 Asia Pacific Information Technology Market by Country
8.3.3.3 Asia Pacific Consumer Electronics Market by Country
8.3.3.4 Asia Pacific Telecommunications Market by Country
8.3.3.5 Asia Pacific Government Market by Country
8.3.3.6 Asia Pacific Others Market by Country
8.3.4 Asia Pacific Next Generation Non-Volatile Memory Market by Country
8.3.4.1 China Next Generation Non-Volatile Memory Market
8.3.4.1.1 China Next Generation Non-Volatile Memory Market by Type
8.3.4.1.2 China Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.1.3 China Next Generation Non-Volatile Memory Market by Application
8.3.4.2 Japan Next Generation Non-Volatile Memory Market
8.3.4.2.1 Japan Next Generation Non-Volatile Memory Market by Type
8.3.4.2.2 Japan Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.2.3 Japan Next Generation Non-Volatile Memory Market by Application
8.3.4.3 India Next Generation Non-Volatile Memory Market
8.3.4.3.1 India Next Generation Non-Volatile Memory Market by Type
8.3.4.3.2 India Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.3.3 India Next Generation Non-Volatile Memory Market by Application
8.3.4.4 South Korea Next Generation Non-Volatile Memory Market
8.3.4.4.1 South Korea Next Generation Non-Volatile Memory Market by Type
8.3.4.4.2 South Korea Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.4.3 South Korea Next Generation Non-Volatile Memory Market by Application
8.3.4.5 Singapore Next Generation Non-Volatile Memory Market
8.3.4.5.1 Singapore Next Generation Non-Volatile Memory Market by Type
8.3.4.5.2 Singapore Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.5.3 Singapore Next Generation Non-Volatile Memory Market by Application
8.3.4.6 Taiwan Next Generation Non-Volatile Memory Market
8.3.4.6.1 Taiwan Next Generation Non-Volatile Memory Market by Type
8.3.4.6.2 Taiwan Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.6.3 Taiwan Next Generation Non-Volatile Memory Market by Application
8.3.4.7 Rest of Asia Pacific Next Generation Non-Volatile Memory Market
8.3.4.7.1 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Type
8.3.4.7.2 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Wafer Size
8.3.4.7.3 Rest of Asia Pacific Next Generation Non-Volatile Memory Market by Application
8.4 LAMEA Next Generation Non-Volatile Memory Market
8.4.1 LAMEA Next Generation Non-Volatile Memory Market by Type
8.4.1.1 LAMEA High-bandwidth Memory (HBM) Market by Country
8.4.1.2 LAMEA Hybrid Memory Cube (HMC) Market by Country
8.4.2 LAMEA Next Generation Non-Volatile Memory Market by Wafer Size
8.4.2.1 LAMEA 300 mm Market by Country
8.4.2.2 LAMEA 200 mm Market by Country
8.4.3 LAMEA Next Generation Non-Volatile Memory Market by Application
8.4.3.1 LAMEA BFSI Market by Country
8.4.3.2 LAMEA Information Technology Market by Country
8.4.3.3 LAMEA Consumer Electronics Market by Country
8.4.3.4 LAMEA Telecommunications Market by Country
8.4.3.5 LAMEA Government Market by Country
8.4.3.6 LAMEA Others Market by Country
8.4.4 LAMEA Next Generation Non-Volatile Memory Market by Country
8.4.4.1 Brazil Next Generation Non-Volatile Memory Market
8.4.4.1.1 Brazil Next Generation Non-Volatile Memory Market by Type
8.4.4.1.2 Brazil Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.1.3 Brazil Next Generation Non-Volatile Memory Market by Application
8.4.4.2 Argentina Next Generation Non-Volatile Memory Market
8.4.4.2.1 Argentina Next Generation Non-Volatile Memory Market by Type
8.4.4.2.2 Argentina Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.2.3 Argentina Next Generation Non-Volatile Memory Market by Application
8.4.4.3 UAE Next Generation Non-Volatile Memory Market
8.4.4.3.1 UAE Next Generation Non-Volatile Memory Market by Type
8.4.4.3.2 UAE Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.3.3 UAE Next Generation Non-Volatile Memory Market by Application
8.4.4.4 Saudi Arabia Next Generation Non-Volatile Memory Market
8.4.4.4.1 Saudi Arabia Next Generation Non-Volatile Memory Market by Type
8.4.4.4.2 Saudi Arabia Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.4.3 Saudi Arabia Next Generation Non-Volatile Memory Market by Application
8.4.4.5 South Africa Next Generation Non-Volatile Memory Market
8.4.4.5.1 South Africa Next Generation Non-Volatile Memory Market by Type
8.4.4.5.2 South Africa Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.5.3 South Africa Next Generation Non-Volatile Memory Market by Application
8.4.4.6 Nigeria Next Generation Non-Volatile Memory Market
8.4.4.6.1 Nigeria Next Generation Non-Volatile Memory Market by Type
8.4.4.6.2 Nigeria Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.6.3 Nigeria Next Generation Non-Volatile Memory Market by Application
8.4.4.7 Rest of LAMEA Next Generation Non-Volatile Memory Market
8.4.4.7.1 Rest of LAMEA Next Generation Non-Volatile Memory Market by Type
8.4.4.7.2 Rest of LAMEA Next Generation Non-Volatile Memory Market by Wafer Size
8.4.4.7.3 Rest of LAMEA Next Generation Non-Volatile Memory Market by Application
Chapter 9. Company Profiles
9.1 Micron Technology, Inc.
9.1.1 Company Overview
9.1.2 Financial Analysis
9.1.3 Segmental and Regional Analysis
9.1.1 Research & Development Expenses
9.1.2 Recent strategies and developments
9.1.2.1 Product Launches and Product Expansions
9.1.3 SWOT Analysis
9.2 Fujitsu Limited
9.2.1 Company Overview
9.2.2 Financial Analysis
9.2.3 Segmental and Regional Analysis
9.2.4 Research & Development Expenses
9.2.5 Recent strategies and developments
9.2.5.1 Product Launches and Product Expansions
9.2.6 SWOT Analysis
9.3 ROHM Co., Ltd.
9.3.1 Company Overview
9.3.2 Financial Analysis
9.3.3 Segmental and Regional Analysis
9.3.4 Research & Development Expense
9.3.5 SWOT Analysis
9.4 Kingston Technology Company, Inc.
9.4.1 Company Overview
9.4.2 SWOT Analysis
9.5 Kioxia Holdings Corporation
9.5.1 Company Overview
9.5.2 Financial Analysis
9.6 Samsung Electronics Co., Ltd. (Samsung Group)
9.6.1 Company Overview
9.6.2 Financial Analysis
9.6.3 Segmental and Regional Analysis
9.6.4 Research & Development Expenses
9.6.5 SWOT Analysis
9.7 Honeywell International, Inc.
9.7.1 Company Overview
9.7.2 Financial Analysis
9.7.3 Segmental and Regional Analysis
9.7.4 Research & Development Expenses
9.7.5 SWOT Analysis
9.8 Infineon Technologies AG
9.8.1 Company Overview
9.8.2 Financial Analysis
9.8.3 Segmental and Regional Analysis
9.8.4 Research & Development Expense
9.8.5 Recent strategies and developments
9.8.5.1 Product Launches and Product Expansions
9.8.6 SWOT Analysis
9.9 Toshiba International Corporation
9.9.1 Company Overview
9.9.2 Financial Analysis
9.9.3 Segmental and Regional Analysis
9.9.4 Research and Development Expense
9.9.5 SWOT Analysis
9.10. Intel Corporation
9.10.1 Company Overview
9.10.2 Financial Analysis
9.10.3 Segmental and Regional Analysis
9.10.4 Research & Development Expenses
9.10.5 SWOT Analysis
Chapter 10. Winning Imperatives for Next Generation Non-Volatile Memory Market

Companies Mentioned

  • Samsung Electronics Co. Ltd
  • Micron Technology, Inc.
  • Fujitsu Limited
  • Honeywell International, Inc.
  • Infineon Technologies AG
  • ROHM Co., Ltd.
  • Toshiba International Corporation
  • Intel Corporation
  • Kingston Technology Company, Inc.
  • Kioxia Holdings Corporation

Methodology

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