Smart cockpits have emerged as a pivotal trend in the modern automotive industry, with their penetration rate in new vehicles steadily increasing. A smart cockpit incorporates advanced human-machine interfaces (HMIs), digital dashboards, Augmented Reality (AR) head-up displays, connected vehicle functions, and Advanced Driver Assistance Systems (ADAS). This report offers a comprehensive analysis of global development trends in these smart cockpit components, along with Taiwan's industry landscape.
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Table of Contents
1. Global Smart Cockpit Development Trends
1.1 Trend #1: Cockpit Chips Evolving Towards High Customization and Hardware-Software Collaborative Design
1.2 Trend #2: Large-Scale, Multi-Screen Connectivity Technologies Creating Immersive HMIs
1.3 Trend #3: In-Vehicle Camera Systems Shifting from "Seeing + Imaging" to "Seeing + Recognition"
1.4 Trend #4: AR-HUD as the Display Interface for Integrated Cockpit Solutions
1.5 Trend #5: HMI Enhanced by AI Technologies, Creating Intelligent Human-Machine Spaces
2. Development of the Smart Cockpit Industry in Taiwan
2.1 Taiwan's IVI Subsystem Deployments in Smart Cockpits Providing Complete Solutions
2.1.1 Display Subsystem
2.1.2 Sensor Subsystem
2.1.3 Smart Connected Subsystem
2.1.4 Domain Controller and Main Control SoCs
2.2 Taiwan's ADAS Subsystems Primarily Focused on the Upstream Sensing Phase
2.2.1 Upstream Sensing Phase
2.2.2 Midstream Decision Phase
2.2.3 Downstream Control Phase
Appendix
List of Companies
List of Figures
Figure 1: Taiwan's Smart Cockpit IVI Subsystem Deployment Areas
Figure 2: Taiwan's Smart Cockpit IVI Subsystems and Major Suppliers
Figure 3: Taiwan's ADAS Subsystem Sensor Deployment and Major Suppliers
Figure 4: Taiwan's ADAS Subsystem Deployment and Major Suppliers
Companies Mentioned (Partial List)
A selection of companies mentioned in this report includes, but is not limited to:
- Amazon
- Audi
- AUO
- Baidu
- BHTC
- BMW
- BOE
- Bosch
- BYD
- Cadillac
- Chimei Motor Electronics
- Continental
- CPT
- Daimler
- Delphi
- Denso
- E-Lead Electronic
- FIC
- Ford
- Foxconn
- GM
- HannStar
- Harman
- HDU
- Hyundai
- iDrive
- Innolux
- JET Optoelectronics
- KIA
- Leap Motion
- Lexus
- LG Display
- LG Electronics
- Lite-On Technology
- MediaTek
- Mercedes-Benz
- Mitsubishi
- MobileDrive
- Mobileye
- N4AI Innovation
- nFore Technology
- Nippon Seiki
- NSK
- Nuance Communications
- Nvidia
- oToBrite
- Qualcomm
- Quanta
- Realtek
- Sony
- Stellantis
- Tesla
- Texas Instruments
- Tianma
- Toyota
- TPK Technology
- TSMC
- UniMax Electronics
- Visteon
- Volkswagen
- Wayray
- Whetron Electronics
- Wistron NeWeb
- ZF
Methodology
Primary research with a holistic, cross-domain approach
The exhaustive primary research methods are central to the value that the analyst delivers. A combination of questionnaires and on-site visits to the major manufacturers provides a first view of the latest data and trends. Information is subsequently validated by interviews with the manufacturers' suppliers and customers, covering a holistic industry value chain. This process is backed up by a cross-domain team-based approach, creating an interlaced network across numerous interrelated components and system-level devices to ensure statistical integrity and provide in-depth insight.
Complementing primary research is a running database and secondary research of industry and market information. Dedicated research into the macro-environmental trends shaping the ICT industry also allows the analyst to forecast future development trends and generate foresight perspectives. With more than 20 years of experience and endeavors in research, the methods and methodologies include:
Method
- Component supplier interviews
- System supplier interviews
- User interviews
- Channel interviews
- IPO interviews
- Focus groups
- Consumer surveys
- Production databases
- Financial data
- Custom databases
Methodology
- Technology forecasting and assessment
- Product assessment and selection
- Product life cycles
- Added value analysis
- Market trends
- Scenario analysis
- Competitor analysis
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