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North America Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2), 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031

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    Report

  • 120 Pages
  • January 2025
  • Region: North America
  • Marqual IT Solutions Pvt. Ltd (KBV Research)
  • ID: 6053178
The North America Advanced Packaging Market is expected to witness market growth of 8.4% CAGR during the forecast period (2024-2031).

The US market dominated the North America Advanced Packaging Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $13.73 billion by 2031. The Canada market is experiencing a CAGR of 10.8% during 2024-2031. Additionally, the Mexico market is expected to exhibit a CAGR of 9.8% during 2024-2031.



Advanced packaging refers to cutting-edge techniques and technologies used in the semiconductor industry to integrate and package electronic chips to enhance their performance, efficiency, and functionality. Unlike traditional packaging methods, which primarily focus on protecting the chips and providing electrical connections, advanced packaging is designed to meet the increasing demands for miniaturization, high-speed data transfer, low power consumption, and effective thermal management. It is crucial in enabling modern electronic devices to deliver superior performance in compact form factors.

At its core, advanced packaging involves the arrangement and interconnection of semiconductor components, such as processors, memory, and sensors, into a single package. This integration is achieved using innovative techniques like System-in-Package (SiP), Fan-Out Wafer Level Packaging (FOWLP), and 3D Integrated Circuits (3D IC). These methods allow multiple chips or components to be combined in a compact design, enabling faster communication between components, improved energy efficiency, and enhanced reliability. Advanced packaging also facilitates heterogeneous integration, where chips of different types, functionalities, or process technologies are integrated into a single unit.

The U.S. government’s strong support for domestic semiconductor manufacturing further bolsters the advanced packaging market. For example, the CHIPS for America Act funds the development of semiconductors and advanced packaging fabrication facilities nationwide, fostering innovation and production capabilities. The National Institute of Standards and Technology (NIST) also extended its funding programs through June 2023, inviting proposals for manufacturing facilities with capital costs exceeding $300 million. These measures underscore the growing need for robust advanced packaging solutions to optimize electronic system performance and meet escalating market demands. As a result, North America remains a lucrative and rapidly growing region for the advanced packaging market throughout the forecast period.

List of Key Companies Profiled

  • Qualcomm Incorporated (Qualcomm Technologies, Inc.)
  • Intel Corporation
  • IBM Corporation
  • Texas Instruments, Inc.
  • Analog Devices, Inc.
  • Microchip Technology Incorporated
  • Infineon Technologies AG
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Renesas Electronics Corporation
  • VMware, Inc. (Broadcom Inc.)

Market Report Segmentation

By Type

  • Flip-Chip Ball Grid Array
  • Fan-out WLP
  • Flip chip CSP
  • Wafer level CSP
  • 5D/3D
  • Other Type

By End User

  • Consumer Electronics
  • Automotive
  • Industrial
  • Healthcare
  • Aerospace & Defense
  • Other End User

By Country

  • US
  • Canada
  • Mexico
  • Rest of North America

Table of Contents

Chapter 1. Market Scope & Methodology
1.1 Market Definition
1.2 Objectives
1.3 Market Scope
1.4 Segmentation
1.4.1 North America Advanced Packaging Market, by Type
1.4.2 North America Advanced Packaging Market, by End User
1.4.3 North America Advanced Packaging Market, by Country
1.5 Methodology for the Research
Chapter 2. Market at a Glance
2.1 Key Highlights
Chapter 3. Market Overview
3.1 Introduction
3.1.1 Overview
3.1.1.1 Market Composition and Scenario
3.2 Key Factors Impacting the Market
3.2.1 Market Drivers
3.2.2 Market Restraints
3.2.3 Market Opportunities
3.2.4 Market Challenges
Chapter 4. Competition Analysis - Global
4.1 Market Share Analysis, 2023
4.2 Strategies Deployed in Advanced Packaging Market
4.3 Porter Five Forces Analysis
Chapter 5. North America Advanced Packaging Market by Type
5.1 North America Flip-Chip Ball Grid Array Market by Country
5.2 North America Fan-out WLP Market by Country
5.3 North America Flip chip CSP Market by Country
5.4 North America Wafer level CSP Market by Country
5.5 North America 2.5D/3D Market by Country
5.6 North America Other Type Market by Country
Chapter 6. North America Advanced Packaging Market by End User
6.1 North America Consumer Electronics Market by Country
6.2 North America Automotive Market by Country
6.3 North America Industrial Market by Country
6.4 North America Healthcare Market by Country
6.5 North America Aerospace & Defense Market by Country
6.6 North America Other End User Market by Country
Chapter 7. North America Advanced Packaging Market by Country
7.1 US Advanced Packaging Market
7.1.1 US Advanced Packaging Market by Type
7.1.2 US Advanced Packaging Market by End User
7.2 Canada Advanced Packaging Market
7.2.1 Canada Advanced Packaging Market by Type
7.2.2 Canada Advanced Packaging Market by End User
7.3 Mexico Advanced Packaging Market
7.3.1 Mexico Advanced Packaging Market by Type
7.3.2 Mexico Advanced Packaging Market by End User
7.4 Rest of North America Advanced Packaging Market
7.4.1 Rest of North America Advanced Packaging Market by Type
7.4.2 Rest of North America Advanced Packaging Market by End User
Chapter 8. Company Profiles
8.1 Qualcomm Incorporated (Qualcomm Technologies, Inc.)
8.1.1 Company Overview
8.1.2 Financial Analysis
8.1.3 Segmental and Regional Analysis
8.1.4 Research & Development Expense
8.1.5 Recent Strategies and Developments
8.1.5.1 Product Launches and Product Expansions
8.1.6 SWOT Analysis
8.2 Intel Corporation
8.2.1 Company Overview
8.2.2 Financial Analysis
8.2.3 Segmental and Regional Analysis
8.2.4 Research & Development Expenses
8.2.5 Recent Strategies and Developments
8.2.5.1 Partnerships, Collaborations, and Agreements
8.2.5.2 Acquisition and Mergers
8.2.6 SWOT Analysis
8.3 IBM Corporation
8.3.1 Company Overview
8.3.2 Financial Analysis
8.3.3 Regional & Segmental Analysis
8.3.4 Research & Development Expenses
8.3.5 Recent Strategies and Developments
8.3.5.1 Partnerships, Collaborations, and Agreements
8.3.5.2 Product Launches and Product Expansions
8.3.6 SWOT Analysis
8.4 Texas Instruments, Inc.
8.4.1 Company Overview
8.4.2 Financial Analysis
8.4.3 Segmental and Regional Analysis
8.4.4 Research & Development Expense
8.4.5 SWOT Analysis
8.5 Analog Devices, Inc.
8.5.1 Company Overview
8.5.2 Financial Analysis
8.5.3 Regional Analysis
8.5.4 Research & Development Expenses
8.5.5 SWOT Analysis
8.6 Microchip Technology Incorporated
8.6.1 Company Overview
8.6.2 Financial Analysis
8.6.3 Segmental and Regional Analysis
8.6.4 Research & Development Expenses
8.6.5 SWOT Analysis
8.7 Infineon Technologies AG
8.7.1 Company Overview
8.7.2 Financial Analysis
8.7.3 Segmental and Regional Analysis
8.7.4 Research & Development Expense
8.7.5 SWOT Analysis
8.8 Samsung Electronics Co., Ltd. (Samsung Group)
8.8.1 Company Overview
8.8.2 Financial Analysis
8.8.3 Segmental and Regional Analysis
8.8.4 Research & Development Expenses
8.8.5 SWOT Analysis
8.9 Renesas Electronics Corporation
8.9.1 Company Overview
8.9.2 Financial Analysis
8.9.3 Segmental and Regional Analysis
8.9.4 Research & Development Expense
8.9.5 SWOT Analysis
8.10. VMware, Inc. (Broadcom Inc.)
8.10.1 Company Overview
8.10.2 Financial Analysis
8.10.3 Segmental and Regional Analysis
8.10.4 Research & Development Expense
8.10.5 SWOT Analysis

Companies Mentioned

  • Qualcomm Incorporated (Qualcomm Technologies, Inc.)
  • Intel Corporation
  • IBM Corporation
  • Texas Instruments, Inc.
  • Analog Devices, Inc.
  • Microchip Technology Incorporated
  • Infineon Technologies AG
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • Renesas Electronics Corporation
  • VMware, Inc. (Broadcom Inc.)

Methodology

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