Europe Advanced Packaging Market Size, Share & Trends Analysis Report By Type (Flip-Chip Ball Grid Array, Fan-out WLP, Flip chip CSP, Wafer level CSP, 2), 5D/3D, and Other Type), By End User, By Country and Growth Forecast, 2024 - 2031

The Europe Advanced Packaging Market is expected to witness market growth of 8.9% CAGR during the forecast period (2024-2031).

The Germany market dominated the Europe Advanced Packaging Market by country in 2023, and is expected to continue to be a dominant market till 2031; thereby, achieving a market value of $3.20 billion by 2031. The UK market is exhibiting a CAGR of 8% during 2024-2031. Additionally, the France market is expected to experience a CAGR of 10.1% during 2024-2031.



In consumer electronics, advanced packaging has been a game-changer, enabling the development of compact, lightweight, and multifunctional devices. Smartphones, tablets, wearables, and AR/VR devices benefit from packaging technologies that optimize performance while maintaining sleek form. As consumers demand more powerful and energy-efficient devices, manufacturers continue to invest in research and development to push the boundaries of packaging innovation. The automotive sector represents another key driver of the advanced packaging market as vehicles become increasingly connected and autonomous. Advanced Driver Assistance Systems (ADAS), electric vehicles (EVs), and in-car infotainment systems rely on high-performance semiconductors that handle complex data processing and communication tasks.

Advanced packaging technologies, such as System-in-Package and Chip-on-Chip, have become essential for enhancing energy efficiency in modern electronic devices. Integrating multiple components like processors, memory, and sensors into a single compact package reduces the distance for electrical signals, minimizing power loss and improving overall efficiency. SiP is widely used in wearables, IoT devices, and medical implants, where long battery life and compact designs are crucial. Similarly, CoC technology, which stacks chips vertically to improve data transfer efficiency, is integral to smartphones and high-performance computing systems, enabling powerful functionality with reduced energy consumption.

Italy’s growing adoption of industrial automation and its focus on sustainable technologies drive demand for advanced packaging in applications like renewable energy systems and smart factories. The country’s robust manufacturing base, combined with its efforts to modernize infrastructure and integrate digital technologies, ensures steady growth in advanced packaging demand across various industrial applications. These trends and strategic initiatives, like the European Chips Act, position Europe as a rapidly growing player in the advanced packaging market, aligning with its broader technological leadership and sustainability goals.

List of Key Companies Profiled

• Qualcomm Incorporated (Qualcomm Technologies, Inc.)
• Intel Corporation
• IBM Corporation
• Texas Instruments, Inc.
• Analog Devices, Inc.
• Microchip Technology Incorporated
• Infineon Technologies AG
• Samsung Electronics Co., Ltd. (Samsung Group)
• Renesas Electronics Corporation
• VMware, Inc. (Broadcom Inc.)

Market Report Segmentation

By Type

• Flip-Chip Ball Grid Array
• Fan-out WLP
• Flip chip CSP
• Wafer level CSP
• 5D/3D
• Other Type

By End User

• Consumer Electronics
• Automotive
• Industrial
• Healthcare
• Aerospace & Defense
• Other End User

By Country

• Germany
• UK
• France
• Russia
• Spain
• Italy
• Rest of Europe