Fan-Out Packaging Market - Forecasts from 2025 to 2030

The Fan-Out Packaging Market will grow at a CAGR of 9.78% during the forecast period of 2022-2030.

Any package with connections fanning out from the chip surface to accommodate more external I/Os is referred to as fan-out packaging. The dies are completely submerged in an epoxy mold compound with conventional fan-out packaging rather than placed on a substrate or interposer. They are rapidly replacing the older, more established package-on-package (PoP), memory-on-logic systems. Additionally, the market's adoption of high-performance computing has expanded due to the growing use of artificial intelligence and machine learning in several industries.

Market Trends:

• Boost from ECP Technology in Fan-Out Packaging: The Fan-Out Packaging Solutions market is set to experience growth spurred by the integration of Encapsulated Chip Package (ECP) technology throughout the forecast period. Since the advent of the Internet and multimedia, the miniaturization of electronics through integrated circuits has become integral to modern life.
• Key Features and Applications: This technology relies on critical elements like mega pillar plating and redistribution layer (RDL) metal. It targets high-pin-count applications, such as application processors (AP), with companies planning to incorporate inFO-Antenna-in-Package (AiP) and inFO-on-Substrate innovations into their Fan-Out Wafer Level Packaging (FO-WLP) offerings. These solutions are widely used in automobiles, servers, and smartphones. Additionally, firms are refining fabrication techniques for High-Density Fan-Out Wafer Level Packaging (FOWLP) to meet rising demand.
• Asia-Pacific: The Asia-Pacific region, led by economic powerhouses like China, Japan, India, and South Korea, is a key player in this market. Taiwan, home to some of the world’s largest semiconductor producers, drives demand for advanced packaging solutions, particularly in PLPs. According to the Semiconductor Industry Association (SIA), the region accounts for over 50% of global semiconductor sales, enabling Taiwanese manufacturers to supply FOWLP for expanding semiconductor needs. Many companies in Taiwan are ramping up fan-out packaging production, enhancing exports and supporting regional market growth.

Some of the major players covered in this report include TSMC Limited, Powertech Technology Inc, Amkor Technology Inc, ASE Inc, INTEVAC, Camtek, NXP Semiconductor, Deca Technologies, and JCET Global, among others:

Key Benefits of this Report:

• Insightful Analysis: Gain detailed market insights covering major as well as emerging geographical regions, focusing on customer segments, government policies and socio-economic factors, consumer preferences, industry verticals, and other sub-segments.
• Competitive Landscape: Understand the strategic maneuvers employed by key players globally to understand possible market penetration with the correct strategy.
• Market Drivers & Future Trends: Explore the dynamic factors and pivotal market trends and how they will shape future market developments.
• Actionable Recommendations: Utilize the insights to exercise strategic decisions to uncover new business streams and revenues in a dynamic environment.
• Caters to a Wide Audience: Beneficial and cost-effective for startups, research institutions, consultants, SMEs, and large enterprises.

What can businesses use this report for?

Industry and Market Insights, Opportunity Assessment, Product Demand Forecasting, Market Entry Strategy, Geographical Expansion, Capital Investment Decisions, Regulatory Framework & Implications, New Product Development, Competitive Intelligence.

Report Coverage:

• Historical data from 2022 to 2024 & forecast data from 2025 to 2030
• Growth Opportunities, Challenges, Supply Chain Outlook, Regulatory Framework, and Trend Analysis
• Competitive Positioning, Strategies, and Market Share Analysis
• Revenue Growth and Forecast Assessment of segments and regions including countries
• Company Profiling (Strategies, Products, Financial Information, and Key Developments among others)

Fan-Out Packaging Market Segmentation:

By Type

• Core Fan-out
• High-density Fan-out
• Ultra-high-density Fan-out

By Carrier Size

• 300mm
• 600mm
• Others

By Material Type

• Substrate Materials
• Encapsulation Materials
• Redistribution Layer (RDL) Materials
• Others

By End-User

• Foundries
• Integrated Device Manufacturers (IDM)
• Outsourced Semiconductor Assembly and Test (OSAT)

By Region

• Americas
• USA
• Europe, Middle East, and Africa
• Germany
• Netherlandss
• Others
• Asia Pacific
• China
• Japan
• Taiwan
• South Korea
• Others