Results for tag: "Ball Array Package"

The Ball Array Package market within the Semiconductor industry is a type of packaging technology used to connect integrated circuits to printed circuit boards. It is a type of surface-mount technology, which is a method of mounting components onto a printed circuit board without the use of through-hole technology. Ball Array Packages are used in a variety of applications, including consumer electronics, automotive, and industrial. The Ball Array Package market is highly competitive, with a number of companies offering a range of products. Companies in the market include Amkor Technology, STATS ChipPAC, ASE Group, and Chipbond Technology. Other companies in the market include ChipMOS Technologies, Powertech Technology, and Siliconware Precision Industries. Show Less Read more