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Results for tag: "Chip On Board"

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SMT Placement Equipment - Global Strategic Business Report - Product Thumbnail Image

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  • 283 Pages
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Organic Substrate Packaging Material Market Report 2025

  • Report
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  • 200 Pages
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Outsourced Semiconductor Assembly and Testing Market Report 2025

  • Report
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Flip Chip Market Report 2025 - Product Thumbnail Image

Flip Chip Market Report 2025

  • Report
  • January 2025
  • 200 Pages
  • Global
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Flip Chip Market Overview, 2024-29 - Product Thumbnail Image

Flip Chip Market Overview, 2024-29

  • Report
  • September 2024
  • 95 Pages
  • Global
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Liquid Encapsulation Market - Forecasts from 2023 to 2028 - Product Thumbnail Image

Liquid Encapsulation Market - Forecasts from 2023 to 2028

  • Report
  • December 2023
  • 132 Pages
  • Global
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Chip on Board (COB) is a type of semiconductor packaging technology that involves mounting integrated circuits (ICs) directly onto a printed circuit board (PCB). This technology is used to reduce the size and cost of electronic devices, as well as to improve their reliability and performance. COB is a cost-effective alternative to traditional surface-mount technology (SMT) and is used in a wide range of applications, including consumer electronics, automotive, medical, and industrial. COB technology is becoming increasingly popular due to its ability to reduce the size and cost of electronic devices. It also offers improved reliability and performance, as well as improved thermal management. Additionally, COB technology is more resistant to environmental conditions such as moisture, dust, and vibration. Some of the major companies in the COB market include Samsung, Intel, Texas Instruments, STMicroelectronics, NXP Semiconductors, and ON Semiconductor. Show Less Read more