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Results for tag: "System In Package"

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. High Performance Compute and System-in-Package. Edition No. 1. IEEE Press - Product Thumbnail Image

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. High Performance Compute and System-in-Package. Edition No. 1. IEEE Press

  • Book
  • January 2022
  • 320 Pages
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Edition No. 1. IEEE Press - Product Thumbnail Image

Advances in Embedded and Fan-Out Wafer Level Packaging Technologies. Edition No. 1. IEEE Press

  • Book
  • March 2019
  • 576 Pages
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. Edition No. 1. IEEE Press - Product Thumbnail Image

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility. Edition No. 1. IEEE Press

  • Book
  • June 2018
  • 464 Pages
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System in Package (SiP) is a type of integrated circuit packaging technology that combines multiple components into a single package. It is a form of system-level integration that allows for the integration of multiple components into a single package, such as a microprocessor, memory, and other components. SiP technology is used to reduce the size and complexity of a system, while also increasing its performance and reliability. SiP technology is used in a variety of applications, including consumer electronics, automotive, and industrial applications. SiP technology is becoming increasingly popular due to its ability to reduce the size and complexity of a system, while also increasing its performance and reliability. SiP technology is also becoming more cost-effective, as it allows for the integration of multiple components into a single package. Some companies in the SiP market include Intel, Qualcomm, Samsung, and Texas Instruments. These companies are leading the way in SiP technology, providing solutions for a variety of applications. Show Less Read more