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Electronic Board Level Underfill and Encapsulation Material Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region- Product Image
Electronic Board Level Underfill and Encapsulation Material Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region- Product Image
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Electronic Board Level Underfill and Encapsulation Material Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast 2031 - By Product, Technology, Grade, Application, End-user, Region

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    Report

  • 278 Pages
  • November 2024
  • Region: Global
  • Fairfield Market Research
  • ID: 6026064
Description Jump to:
The Global Electronic Board Level Underfill and Encapsulation Material Market is anticipated to experience steady growth, projected to achieve a valuation of US$ 486 million by 2031 from its 2024 valuation of US$ 343.89 million. This growth, according to the publisher, reflects a compound annual growth rate (CAGR) of 5.10%, driven by the booming demand for smartphones, wireless devices, laptops, internet infrastructure, and the increasing integration of electronics in the automotive sector.

Consumer electronics, particularly devices like smartphones, tablets, and laptops, have seen remarkable growth in recent years, spurring demand for advanced underfill and encapsulation materials used in electronic board applications. These materials are essential for providing durability, reliability, and performance in compact electronic devices, and their demand is expected to rise with ongoing advancements in electronic miniaturization.

Key Market Drivers

1. Expanding Electronics Industry: The electronics and electrical sectors have grown dynamically, bolstered by technological advancements, research, and development (R&D) investments. A significant shift is noted in manufacturing capacity and the production of high-value electronics products, meeting consumer demands for high-performance and cost-efficient devices.

2. Rise of Miniaturization in Electronics: Increasing miniaturization, especially in consumer electronics, has escalated the demand for printed circuit boards (PCBs) that employ flip-chip technology. This trend has necessitated smaller, more integrated PCBs that use underfill and encapsulation materials for added structural integrity and reliability.

3. Booming Consumer Electronics Market: Consumer electronics remains one of the fastest-growing markets, with consumers continually seeking the latest innovations in devices. This rising demand, coupled with increased disposable income in both developed and developing regions, significantly contributes to the growth of the underfill and encapsulation materials market.

Business Opportunities

The market offers numerous business opportunities, especially in product innovation for miniaturized electronics. The increasing demand for reliable, high-performance underfill materials is expected to create new avenues for investment and expansion, particularly in Asia’s electronics manufacturing hubs.

Regional Analysis

  • Asia Pacific: Leading the charge in electronics manufacturing, Asia Pacific accounts for a significant portion of global electronics production, including consumer electronics like televisions, mobile phones, and laptops. The ASEAN region alone produces over 80% of the world’s hard drives, with Thailand emerging as a prominent hub for manufacturing electronic components. China, recognized for its strong supply chain infrastructure, and India, a rapidly growing electronics manufacturing base, further consolidate Asia Pacific’s dominance in the global market.
  • China: China’s electronic industry, marked by rapid growth and annual increases of about 20%, is integral to the region’s economic strength. The demand for underfill and encapsulation materials is anticipated to rise in tandem with the country’s thriving Information and Communication Technology (ICT) sector and consumer electronics industry.
  • India: India's electronics manufacturing sector has experienced remarkable growth in recent years, supported by government initiatives and investments in production-linked incentive (PLI) schemes. These efforts are anticipated to further boost market expansion, with strong consumer demand for smartphones and other electronic devices playing a key role in driving growth.

Competitive Analysis

The Global Electronic Board Level Underfill and Encapsulation Material Market is moderately fragmented, with numerous international manufacturers present.

Key Players in the Market

  • Henkel AG & Co. KGaA
  • Namics Corporation
  • ASE Group
  • MacDermid Alpha Electronic Solutions
  • Parker LORD Corporation
  • H.B. Fuller Company
  • The Dow Chemical Company
  • ELANTAS GmbH
  • Zymet
  • Hitachi Chemical Co., Ltd.
  • Panasonic Corporation
  • AI Technology, Inc.
  • Indium Corporation
  • Sanyu Rec Co., Ltd.
  • Dymax Corporation
  • Epoxy Technology, Inc.
  • Protavic International
  • YINCAE Advanced Materials, LLC

Electronic Board Level Underfill and Encapsulation Material Market Segmentation

1. By Product Type
  • Underfills
  • Capillary
  • Edge Bonds
  • Gob Top Encapsulations
2. By Material Type
  • Quartz/Silicone
  • Alumina Based
  • Epoxy Based
  • Urethane Based
  • Acrylic Based
  • Others
3. By Board Type
  • CSP (Chip Scale Package)
  • BGA (Ball Grid Array)
  • Flip Chips
4. By Region
  • North America
  • Latin America
  • Europe
  • East Asia
  • South Asia Pacific
  • Middle East and Africa (MEA)


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Table of Contents

1. Executive Summary
1.1. Global Electronic Board Level Underfill and Encapsulation Material Market Snapshot
1.2. Future Projections
1.3. Key Market Trends
1.4. Regional Snapshot, by Value, 2024
1.5. Analyst Recommendations
2. Market Overview
2.1. Market Definitions and Segmentations
2.2. Market Dynamics
2.2.1. Drivers
2.2.2. Restraints
2.2.3. Market Opportunities
2.3. Value Chain Analysis
2.4. Porter’s Five Forces Analysis
2.5. COVID-19 Impact Analysis
2.5.1. Supply
2.5.2. Demand
2.6. Impact of Ukraine-Russia Conflict
2.7. Economic Overview
2.7.1. World Economic Projections
2.8. PESTLE Analysis
3. Price Analysis, 2018 - 2023
3.1. Global Average Price Analysis, by Product Type, US$ Per Unit, 2018 - 2023
3.2. Prominent Factor Affecting Electronic Board Level Underfill and Encapsulation Material Prices
3.3. Global Average Price Analysis, by Region, US$ Per Unit
4. Global Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
4.1. Global Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
4.1.1. Key Highlights
4.1.1.1. Underfills
4.1.1.1.1. Capillary
4.1.1.1.2. Edge Bonds
4.1.1.2. Gob Top Encapsulations
4.2. Global Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
4.2.1. Key Highlights
4.2.1.1. Quartz/Silicone
4.2.1.2. Alumina Based
4.2.1.3. Epoxy Based
4.2.1.4. Urethane Based
4.2.1.5. Acrylic Based
4.2.1.6. Others
4.3. Global Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
4.3.1. Key Highlights
4.3.1.1. CSP (Chip Scale Package)
4.3.1.2. BGA (Ball Grid array)
4.3.1.3. Flip Chips
4.4. Global Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Region, Value (US$ Mn), 2019-2031
4.4.1. Key Highlights
4.4.1.1. North America
4.4.1.2. Europe
4.4.1.3. Asia Pacific
4.4.1.4. Latin America
4.4.1.5. Middle East & Africa
5. North America Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
5.1. North America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
5.1.1. Key Highlights
5.1.1.1. Underfills
5.1.1.1.1. Capillary
5.1.1.1.2. Edge Bonds
5.1.1.2. Gob Top Encapsulations
5.2. North America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
5.2.1. Key Highlights
5.2.1.1. Quartz/Silicone
5.2.1.2. Alumina Based
5.2.1.3. Epoxy Based
5.2.1.4. Urethane Based
5.2.1.5. Acrylic Based
5.2.1.6. Others
5.3. North America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
5.3.1. Key Highlights
5.3.1.1. CSP (Chip Scale Package)
5.3.1.2. BGA (Ball Grid array)
5.3.1.3. Flip Chips
5.4. North America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Country, Value (US$ Mn), 2019-2031
5.4.1. Key Highlights
5.4.1.1. U.S. Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
5.4.1.2. U.S. Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
5.4.1.3. U.S. Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
5.4.1.4. Canada Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
5.4.1.5. Canada Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
5.4.1.6. Canada Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
5.4.2. BPS Analysis/Market Attractiveness Analysis
6. Europe Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
6.1. Europe Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
6.1.1. Key Highlights
6.1.1.1. Underfills
6.1.1.1.1. Capillary
6.1.1.1.2. Edge Bonds
6.1.1.2. Gob Top Encapsulations
6.2. Europe Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
6.2.1. Key Highlights
6.2.1.1. Quartz/Silicone
6.2.1.2. Alumina Based
6.2.1.3. Epoxy Based
6.2.1.4. Urethane Based
6.2.1.5. Acrylic Based
6.2.1.6. Others
6.3. Europe Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
6.3.1. Key Highlights
6.3.1.1. CSP (Chip Scale Package)
6.3.1.2. BGA (Ball Grid array)
6.3.1.3. Flip Chips
6.4. Europe Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Country, Value (US$ Mn), 2019-2031
6.4.1. Key Highlights
6.4.1.1. Germany Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.2. Germany Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.3. Germany Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.4. U.K. Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.5. U.K. Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.6. U.K. Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.7. France Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.8. France Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.9. France Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.10. Italy Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.11. Italy Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.12. Italy Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.13. Turkey Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.14. Turkey Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.15. Turkey Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.16. Russia Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.17. Russia Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.18. Russia Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.1.19. Rest of Europe Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
6.4.1.20. Rest of Europe Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
6.4.1.21. Rest of Europe Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
6.4.2. BPS Analysis/Market Attractiveness Analysis
7. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
7.1. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
7.1.1. Key Highlights
7.1.1.1. Underfills
7.1.1.1.1. Capillary
7.1.1.1.2. Edge Bonds
7.1.1.2. Gob Top Encapsulations
7.2. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
7.2.1. Key Highlights
7.2.1.1. Quartz/Silicone
7.2.1.2. Alumina Based
7.2.1.3. Epoxy Based
7.2.1.4. Urethane Based
7.2.1.5. Acrylic Based
7.2.1.6. Others
7.3. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
7.3.1. Key Highlights
7.3.1.1. CSP (Chip Scale Package)
7.3.1.2. BGA (Ball Grid array)
7.3.1.3. Flip Chips
7.4. Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Country, Value (US$ Mn), 2019-2031
7.4.1. Key Highlights
7.4.1.1. China Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.2. China Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.3. China Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.1.4. Japan Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.5. Japan Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.6. Japan Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.1.7. South Korea Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.8. South Korea Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.9. South Korea Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.1.10. India Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.11. India Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.12. India Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.1.13. Southeast Asia Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.14. Southeast Asia Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.15. Southeast Asia Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.1.16. Rest of Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
7.4.1.17. Rest of Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
7.4.1.18. Rest of Asia Pacific Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
7.4.2. BPS Analysis/Market Attractiveness Analysis
8. Latin America Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
8.1. Latin America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
8.1.1. Key Highlights
8.1.1.1. Underfills
8.1.1.1.1. Capillary
8.1.1.1.2. Edge Bonds
8.1.1.2. Gob Top Encapsulations
8.2. Latin America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
8.2.1. Key Highlights
8.2.1.1. Quartz/Silicone
8.2.1.2. Alumina Based
8.2.1.3. Epoxy Based
8.2.1.4. Urethane Based
8.2.1.5. Acrylic Based
8.2.1.6. Others
8.3. Latin America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
8.3.1. Key Highlights
8.3.1.1. CSP (Chip Scale Package)
8.3.1.2. BGA (Ball Grid array)
8.3.1.3. Flip Chips
8.4. Latin America Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Country, Value (US$ Mn), 2019-2031
8.4.1. Key Highlights
8.4.1.1. Brazil Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
8.4.1.2. Brazil Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
8.4.1.3. Brazil Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
8.4.1.4. Mexico Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
8.4.1.5. Mexico Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
8.4.1.6. Mexico Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
8.4.1.7. Argentina Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
8.4.1.8. Argentina Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
8.4.1.9. Argentina Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
8.4.1.10. Rest of Latin America Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
8.4.1.11. Rest of Latin America Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
8.4.1.12. Rest of Latin America Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
8.4.2. BPS Analysis/Market Attractiveness Analysis
9. Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Outlook, 2019-2031
9.1. Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Product Type, Value (US$ Mn), 2019-2031
9.1.1. Key Highlights
9.1.1.1. Underfills
9.1.1.1.1. Capillary
9.1.1.1.2. Edge Bonds
9.1.1.2. Gob Top Encapsulations
9.2. Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Material Type, Value (US$ Mn), 2019-2031
9.2.1. Key Highlights
9.2.1.1. Quartz/Silicone
9.2.1.2. Alumina Based
9.2.1.3. Epoxy Based
9.2.1.4. Urethane Based
9.2.1.5. Acrylic Based
9.2.1.6. Others
9.3. Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Board Type, Value (US$ Mn), 2019-2031
9.3.1. Key Highlights
9.3.1.1. CSP (Chip Scale Package)
9.3.1.2. BGA (Ball Grid array)
9.3.1.3. Flip Chips
9.4. Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market Outlook, by Country, Value (US$ Mn), 2019-2031
9.4.1. Key Highlights
9.4.1.1. GCC Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
9.4.1.2. GCC Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
9.4.1.3. GCC Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
9.4.1.4. South Africa Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
9.4.1.5. South Africa Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
9.4.1.6. South Africa Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
9.4.1.7. Egypt Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
9.4.1.8. Egypt Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
9.4.1.9. Egypt Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
9.4.1.10. Nigeria Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
9.4.1.11. Nigeria Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
9.4.1.12. Nigeria Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
9.4.1.13. Rest of Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market by Product Type, Value (US$ Mn), 2019-2031
9.4.1.14. Rest of Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market by Material Type, Value (US$ Mn), 2019-2031
9.4.1.15. Rest of Middle East & Africa Electronic Board Level Underfill and Encapsulation Material Market by Board Type, Value (US$ Mn), 2019-2031
9.4.2. BPS Analysis/Market Attractiveness Analysis
10. Competitive Landscape
10.1. Product Type vs Material Heatmap
10.2. Manufacturer vs Material Heatmap
10.3. Company Market Share Analysis, 2022
10.4. Competitive Dashboard
10.5. Company Profiles
10.5.1. Henkel AG and Co. KGaA
10.5.1.1. Company Overview
10.5.1.2. Product Portfolio
10.5.1.3. Financial Overview
10.5.1.4. Business Strategies and Development
10.5.2. Namics Corporation
10.5.2.1. Company Overview
10.5.2.2. Product Portfolio
10.5.2.3. Financial Overview
10.5.2.4. Business Strategies and Development
10.5.3. ASE Group
10.5.3.1. Company Overview
10.5.3.2. Product Portfolio
10.5.3.3. Financial Overview
10.5.3.4. Business Strategies and Development
10.5.4. MacDermid Alpha Electronic Solutions
10.5.4.1. Company Overview
10.5.4.2. Product Portfolio
10.5.4.3. Financial Overview
10.5.4.4. Business Strategies and Development
10.5.5. Parker LORD Corporation
10.5.5.1. Company Overview
10.5.5.2. Product Portfolio
10.5.5.3. Financial Overview
10.5.5.4. Business Strategies and Development
10.5.6. H.B. Fuller Company
10.5.6.1. Company Overview
10.5.6.2. Product Portfolio
10.5.6.3. Financial Overview
10.5.6.4. Business Strategies and Development
10.5.7. The Dow Chemical Company
10.5.7.1. Company Overview
10.5.7.2. Product Portfolio
10.5.7.3. Financial Overview
10.5.7.4. Business Strategies and Development
10.5.8. ELANTAS GmbH
10.5.8.1. Company Overview
10.5.8.2. Product Portfolio
10.5.8.3. Financial Overview
10.5.8.4. Business Strategies and Development
10.5.9. Zymet
10.5.9.1. Company Overview
10.5.9.2. Product Portfolio
10.5.9.3. Financial Overview
10.5.9.4. Business Strategies and Development
10.5.10. Hitachi Chemical Co., Ltd.
10.5.10.1. Company Overview
10.5.10.2. Product Portfolio
10.5.10.3. Financial Overview
10.5.10.4. Business Strategies and Development
10.5.11. Panasonic Corporation
10.5.11.1. Company Overview
10.5.11.2. Product Portfolio
10.5.11.3. Financial Overview
10.5.11.4. Business Strategies and Development
10.5.12. AI Technology, Inc.
10.5.12.1. Company Overview
10.5.12.2. Product Portfolio
10.5.12.3. Financial Overview
10.5.12.4. Business Strategies and Development
10.5.13. Indium Corporation
10.5.13.1. Company Overview
10.5.13.2. Product Portfolio
10.5.13.3. Financial Overview
10.5.13.4. Business Strategies and Development
10.5.14. Sanyu Rec Co., Ltd.
10.5.14.1. Company Overview
10.5.14.2. Product Portfolio
10.5.14.3. Financial Overview
10.5.14.4. Business Strategies and Development
10.5.15. Dymax Corporation
10.5.15.1. Company Overview
10.5.15.2. Product Portfolio
10.5.15.3. Financial Overview
10.5.15.4. Business Strategies and Development
10.5.16. Epoxy Technology, Inc.
10.5.16.1. Company Overview
10.5.16.2. Product Portfolio
10.5.16.3. Financial Overview
10.5.16.4. Business Strategies and Development
10.5.17. Protavic International
10.5.17.1. Company Overview
10.5.17.2. Product Portfolio
10.5.17.3. Financial Overview
10.5.17.4. Business Strategies and Development
10.5.18. YINCAE Advanced Materials, LLC
10.5.18.1. Company Overview
10.5.18.2. Product Portfolio
10.5.18.3. Financial Overview
10.5.18.4. Business Strategies and Development
11. Appendix
11.1. Research Methodology
11.2. Report Assumptions
11.3. Acronyms and Abbreviations

Companies Mentioned

  • Henkel AG and Co. KGaA
  • Namics Corporation
  • AI Technology, Inc.
  • Protavic International
  • H.B. Fuller Company
  • ASE Group
  • Hitachi Chemical Co., Ltd.
  • Indium Corporation
  • Zymet
  • YINCAE Advanced Materials, LLC
  • LORD Corporation
  • Sanyu Rec Co., Ltd.
  • The Dow Chemical Company
  • Epoxy Technology, Inc.
  • Panasonic Corporation
  • Dymax Corporation
  • ELANTAS GmbH

Methodology

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