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Results for tag: "Underfill"

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Underfill Materials - Global Strategic Business Report - Product Thumbnail Image

Underfill Materials - Global Strategic Business Report

  • Report
  • March 2025
  • 273 Pages
  • Global
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Electronic Adhesives Market Report 2025 - Product Thumbnail Image

Electronic Adhesives Market Report 2025

  • Report
  • February 2025
  • 200 Pages
  • Global
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Optical Adhesives Market Report 2025 - Product Thumbnail Image

Optical Adhesives Market Report 2025

  • Report
  • March 2025
  • 200 Pages
  • Global
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Underfill Dispensers - Global Strategic Business Report - Product Thumbnail Image

Underfill Dispensers - Global Strategic Business Report

  • Report
  • March 2025
  • 304 Pages
  • Global
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Flip Chip Market Overview, 2024-29 - Product Thumbnail Image

Flip Chip Market Overview, 2024-29

  • Report
  • September 2024
  • 95 Pages
  • Global
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Europe Semiconductor Advance Packaging Market Outlook, 2029 - Product Thumbnail Image

Europe Semiconductor Advance Packaging Market Outlook, 2029

  • Report
  • September 2024
  • 100 Pages
  • Europe
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The Underfill market within the Semiconductor industry is a specialized segment of the larger semiconductor industry. It involves the use of a material, typically an epoxy, to fill the gap between a chip and its substrate. This helps to reduce the risk of chip failure due to thermal expansion and contraction, as well as providing additional mechanical strength. Underfill materials are also used to improve the reliability of flip chip packages, and to reduce the risk of solder joint fatigue. Underfill materials are typically applied using a dispensing process, and can be cured using either thermal or UV curing methods. The selection of the appropriate underfill material is critical to the success of the application, and must be chosen based on the specific requirements of the application. The Underfill market is an important part of the semiconductor industry, and is expected to continue to grow in the coming years. Some companies in the Underfill market include Henkel, Dow Corning, Master Bond, and Shin-Etsu Chemical. Show Less Read more